Products

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly™ TC248SF is an epoxy composite surfacing film, allowing a smooth, paintable surface from tooling or, a thin-skinned honeycomb stiffened composite structure. It may be cured under vacuum only pressure or under low autoclave pressure.

Toray MicroPly SC72A is a low-density unsupported epoxy syntactic core. Offering reduced processing, a one-shot cure, the ability to anchor inserts or fastenings & increases the opportunity to consider lightweight, thin-walled composite sandwich structures

Toray MicroPly™ EX-1541 cyanate ester syntactic foam is unique due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and is easily machined to shape if required.

Toray MicroPly™ EX-1516 cyanate ester film adhesive which has been formulated for low moisture absorption and / or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures.

MicroPly™ ES72A-2 low-density, expanding, unsupported, epoxy syntactic core. Offering reduced processing, a one-shot cure, the ability to anchor inserts / fastenings and, the opportunity to consider lightweight, thin walled composite sandwich structures.

Toray Cetex® TC1225 is a high-end thermoplastic composite material, utilizing a semi-crystalline low-melt polyarlyetherketone resin with excellent mechanical performance and lower processing temperatures.

Toray Cetex® TC1000 Design is a cost-effective, high-end thermoplastic composite, utilizing the amorphous PEI polymer for outstanding toughness and an inherently outstanding fire, smoke, and toxicity performance (< 15/15 OSU).

Toray AmberTool® HX42 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 210°C (410°F) is achieved. Toray AmberTool® HX42 has proven pedigree in aerospace tooling.

TC890 is a very high temperature polyimide prepreg utilizing PROOF 900HT resin system. It has a service temperature capability up to 427°C (800°F). It displays exceptional toughness, superb low dielectric loss properties and is thermally stable.

Toray TC750 is a toughened epoxy component prepreg developed for structural applications within high performance automotive. TC750 facilitates curing from 80°C (176°F) to 180°C (356°F) and can be pre-impregnated into a range of fiberand fabric types.

TC410 cyanate ester prepreg achieves extremely low moisture absorption and high conversion levels. TC410 is designed specifically for radomes and satellite structures, providing good resistance to radiation, low microcracking and, low dielectric and loss.

RS-8HT is a BMI resin which provides excellent elevated temperature properties and processability. RS-8HT has been evaluated and qualified in the areas of satellite and airframe / missile structures.

RS-3 is a modified cyanate ester prepreg, providing a good balance between toughness and high temperature/wet performance. RS-3 is qualified in satellite, airframe/missile and, radome structures. RS-3C is a controlled flow vacuum bag only cure version.

EX-1515 cyanate ester prepreg provides optimal mechanical properties, high radiation resistance, microcracking resistance, low moisture absorption / low outgassing while retaining toughness, a low 244°F (118°C) stress-free temperature and long out time.

E731 is a toughened epoxy component prepreg designed to deliver enhanced resin clarity for cosmetic components within high performance automotive. The E731 resin formulation ensures that components are free from white-spots and exhibit high clarity.

E722 is a 120°C (248°F) cure toughened epoxy component prepreg. E722 is designed for structural applications in motorsport and marine industries and, a wide range of engineering applications.

E721-FR is a 120°C (248°F) cure modified epoxy prepreg of medium viscosity. E721-FR offers excellent structural properties, flame retardancy and exceptional toughness allowing direct lamination to honeycomb without the use of a film adhesive.

BTCy-2 is our lowest dielectric cyanate ester prepreg resin system. This resin system is valued in high-energy microwave applications due to the low loss tangent.

BTCy-1 is a 177°C (350°F) curing cyanate ester prepreg and is an industry standard for use on satellite structures and radomes.

BT250E-6 resin system is a 121°C (250°F) cure epoxy with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-accepted database on carbon IM-7 UD tape, S2-glass, and AS-4C plain weave.

BT250E-1 is a 121°C (250°F) cure epoxy prepreg with excellent toughness and strength. It provides an outstanding surface finish with VBO. BT250E-1 is self-adhesive to honeycomb and foam core and, is MIL-R-9300 qualified.

8020-FR is a modified epoxy component prepreg offers excellent structural properties, flame retardancy, and toughness. The Toray 8020-FR resin system has been developed to offer a long out life and flexible cure schedules from 70–120°C (158–248°F).