Products

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly™ TC248SF is an epoxy composite surfacing film, allowing a smooth, paintable surface from tooling or, a thin-skinned honeycomb stiffened composite structure. It may be cured under vacuum only pressure or under low autoclave pressure.

Toray MicroPly SC72A is a low-density unsupported epoxy syntactic core. Offering reduced processing, a one-shot cure, the ability to anchor inserts or fastenings & increases the opportunity to consider lightweight, thin-walled composite sandwich structures

MicroPly™ ES72A-2 low-density, expanding, unsupported, epoxy syntactic core. Offering reduced processing, a one-shot cure, the ability to anchor inserts / fastenings and, the opportunity to consider lightweight, thin walled composite sandwich structures.

Toray MicroPly™ EF8020 is a modified, high-strength, structural epoxy film adhesive for honeycomb core and laminate bonding. EF8020 is compatible for co-cure with Toray’s 8020 prepreg and SC8020 syntactic core.

Toray AmberTool® HX42 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 210°C (410°F) is achieved. Toray AmberTool® HX42 has proven pedigree in aerospace tooling.

Toray AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX40 is ideal for high temperature larger scale tooling.

Toray TC750 is a toughened epoxy component prepreg developed for structural applications within high performance automotive. TC750 facilitates curing from 80°C (176°F) to 180°C (356°F) and can be pre-impregnated into a range of fiberand fabric types.

Toray TC522 is a highly toughened modified epoxy resin system. TC522 displays outstanding Compression After Impact (CAI), setting it apart from other resins designed for dielectric applications.

TC380 is a toughened epoxy prepreg, balanced with excellent OHC, OHT, CAI, and GIC/GIIC properties, low moisture absorption and outstanding hot/wet retention. TC380 is optimized to facilitate the construction of large or complex composite assemblies.

TC275-1E is a dual cure toughened epoxy prepreg designed to facilitate a thick or larger composite part construction with low pressure or vacuum pressure cures. The resin system features a 28 day total out time.

RS-50 is a toughened low viscosity epoxy RTM resin which can be used in wet winding, RTM and VARTM processing. RS-50 has a long four hour pot life.

MS-1H is carbon fiber / epoxy resin compression molding system using high modulus PAN carbon fiber. MS-1H is an excellent high stiffness BMC, qualified to military and commercial applications MS-1H is offered with 1” or ½” carbon fibers for smaller parts.

EX-1522 is a toughened modified epoxy prepreg. EX-1522 displays very low moisture absorption, also excellent mechanical and thermal properties. EX-1522 has a flammability rating of V-0, which lends itself to usage in low flammability applications.

E760 is a highly toughened epoxy component prepreg with exceptional high temperature performance. E760 has been designed for use in mechanically demanding structural applications exposed to elevated temperature environments e.g. Formula 1.

E750 is a toughened epoxy component prepreg developed for structural applications within Formula 1 and high performance automotive. E750 allows curing from 80°C (176°F) to 180°C (356°F) and can be impregnated into a range of fiber and fabric types.

E731 is a toughened epoxy component prepreg designed to deliver enhanced resin clarity for cosmetic components within high performance automotive. The E731 resin formulation ensures that components are free from white-spots and exhibit high clarity.

E722 is a 120°C (248°F) cure toughened epoxy component prepreg. E722 is designed for structural applications in motorsport and marine industries and, a wide range of engineering applications.

E721-FR is a 120°C (248°F) cure modified epoxy prepreg of medium viscosity. E721-FR offers excellent structural properties, flame retardancy and exceptional toughness allowing direct lamination to honeycomb without the use of a film adhesive.

E720 is a 120°C (248°F) cure toughened epoxy prepreg. E720 offers excellent adhesive properties, allowing direct lamination to honeycomb without the use of a film adhesive.

BT250E-6 resin system is a 121°C (250°F) cure epoxy with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-accepted database on carbon IM-7 UD tape, S2-glass, and AS-4C plain weave.

BT250E-1 is a 121°C (250°F) cure epoxy prepreg with excellent toughness and strength. It provides an outstanding surface finish with VBO. BT250E-1 is self-adhesive to honeycomb and foam core and, is MIL-R-9300 qualified.

8020-FR is a modified epoxy component prepreg offers excellent structural properties, flame retardancy, and toughness. The Toray 8020-FR resin system has been developed to offer a long out life and flexible cure schedules from 70–120°C (158–248°F).

8020 toughened epoxy component prepreg offers an excellent balance of mechanical properties and excellent surface finish. The Toray 8020 resin system has been developed to offer a long outlife and flexible cure schedules from 70-130°C (158-266°F).