Products

Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with Toray’s high temperature TC420 prepreg resin systems.

Toray MicroPly™ TCF4001 cyanate ester syntactic foam is unique in the industry due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and can be machined to shape.

Toray MicroPly™ TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. It is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Toray MicroPly™ TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. It may be used in low pressure vacuum only, out-of-autoclave processes or in autoclave processes at 15 psi.

Toray MicroPly™ SF-5 is a cyanate ester based syntactic film with compatibility to various cyanate ester matrices, including troray RS-3. It is available in unsupported and supported continuous film form in thicknesses from 0.25–6.35 mm (10–250 mils).

Toray MicroPly™ EX-1541 cyanate ester syntactic foam is unique due to its extremely low density and good structural properties. It does not require pressure during cure to achieve it mechanical properties and is easily machined to shape if required.

Toray MicroPly™ EX-1516 cyanate ester film adhesive which has been formulated for low moisture absorption and / or low dielectric constant and loss applications. It provides strength and toughness when bonding solid, honeycomb or foam core structures.

Toray MicroPly™ EM-5A is an expanding cyanate ester syntactic film (core splice). Its' unexpanded density is approximately 0.80 g/cc (50 pcf) and it exhibits an expansion ratio of up to 4 times. It is available in continuous film rolls or in sheet form.

Toray MicroPly™ EM-3 is a 121°C (250°F) curing expanding epoxy film of controlled thickness, based on low density syntactic film technology. It is an effective material in generating internal pressure in a closed mold application.

Toray Cetex® TC1225 is a high-end thermoplastic composite material, utilizing a semi-crystalline low-melt polyarlyetherketone resin with excellent mechanical performance and lower processing temperatures.

Toray AmberTool® HX42 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 210°C (410°F) is achieved. Toray AmberTool® HX42 has proven pedigree in aerospace tooling.

Toray AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190ºC (374ºF) is achieved. Toray AmberTool® HX40 is ideal for high temperature larger scale tooling.

TC890 is a very high temperature polyimide prepreg utilizing PROOF 900HT resin system. It has a service temperature capability up to 427°C (800°F). It displays exceptional toughness, superb low dielectric loss properties and is thermally stable.

Toray TC522 is a highly toughened modified epoxy resin system. TC522 displays outstanding Compression After Impact (CAI), setting it apart from other resins designed for dielectric applications.

RS-8HT is a BMI resin which provides excellent elevated temperature properties and processability. RS-8HT has been evaluated and qualified in the areas of satellite and airframe / missile structures.

RS-3 is a modified cyanate ester prepreg, providing a good balance between toughness and high temperature/wet performance. RS-3 is qualified in satellite, airframe/missile and, radome structures. RS-3C is a controlled flow vacuum bag only cure version.

RS-16 is a two-part low viscosity cyanate ester RTM resin for wet winding, RTM and VARTM processing. RS-16 is intended for lower temperature exposure and is an ideal system when used with different materials limiting the upper cure temperature.

Toray’s Nomex® aerospace grade honeycomb core is manufactured from Nomex® paper sheets, coated and bonded together with a phenolic resin. It offers high strength to weight properties at relatively low cost and, FST performance where required.

EX-1545 is a toughened two-part cyanate ester resin with extremely low viscosity at room temperature, allowing RTM to take place with minimal resin heating. This facilitates mold filling time for difficult and / or large RTM’d structures and reduces waste.

EX-1522 is a toughened modified epoxy prepreg. EX-1522 displays very low moisture absorption, also excellent mechanical and thermal properties. EX-1522 has a flammability rating of V-0, which lends itself to usage in low flammability applications.

EX-1515 cyanate ester prepreg provides optimal mechanical properties, high radiation resistance, microcracking resistance, low moisture absorption / low outgassing while retaining toughness, a low 244°F (118°C) stress-free temperature and long out time.

BTCy-2 is our lowest dielectric cyanate ester prepreg resin system. This resin system is valued in high-energy microwave applications due to the low loss tangent.

BTCy-1A is a toughened cyanate ester prepreg. BTCy-1A’s straight-up, easy processing at 177°C (350°F) under low pressure, reduces curing time and production costs, while the system’s negligible volatile emission upon cure allows low void laminates.

BTCy-1 is a 177°C (350°F) curing cyanate ester prepreg and is an industry standard for use on satellite structures and radomes.

BT250E-1 is a 121°C (250°F) cure epoxy prepreg with excellent toughness and strength. It provides an outstanding surface finish with VBO. BT250E-1 is self-adhesive to honeycomb and foam core and, is MIL-R-9300 qualified.